Properties of Hylimide?TPI356 Corlorless Polyimide Film
|
Project |
Unit |
Property Index |
Test Condition |
Test Standard |
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|
Film Thickness |
µm |
12.5 |
25 |
50 |
23℃ |
ASTM D374 |
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|
Glass-transition Temperature(Tg） |
℃ |
356 |
356 |
356 |
10℃/min,N2 |
- |
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|
Optical Property |
Transmission |
% |
83 |
83 |
83 |
23℃,400nm |
ASTM D1003 |
|
|
Transmission |
% |
87 |
87 |
87 |
23℃,500nm |
ASTM D1003 |
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|
Refractive(nTE) |
|
1.56 |
1.56 |
1.56 |
23℃ |
ASTM D1003 |
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|
Refractive(nTM) |
|
1.55 |
1.55 |
1.55 |
23℃ |
ASTM D1003 |
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|
Mechanical Property |
Ten.Strength |
MPa |
145 |
170 |
160 |
23℃ |
ASTM D882 |
|
|
Elongation |
% |
15 |
20 |
20 |
23℃ |
ASTM D882 |
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|
Ten.Modulus |
GPa |
2 |
3 |
4 |
23℃ |
ASTM D882 |
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|
Electrical Property |
Diel. Constant |
– |
3.3 |
3.3 |
3.3 |
1MHz 23℃ |
ASTM D150 |
|
|
Dielectric Dissipation Factor |
– |
0.007 |
0.007 |
0.007 |
1MHz 23℃ |
ASTM D150 |
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|
Volume Resistivity |
Ω?cm |
＞1014 |
＞1014 |
＞1014 |
500V 23℃ |
ASTM D257 |
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|
Surface Resistivity |
Ω |
＞1014 |
＞1014 |
＞1014 |
500V 23℃ |
ASTM D257 |
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|
Dielectric Strength |
v/µm |
160 |
200 |
180 |
23℃ |
ASTM D149 |
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|
Thermal Property |
CTE |
ppm/℃ |
18 |
18 |
18 |
100～200℃ |
ASTM D696 |
|
|
30 |
30 |
30 |
200-300℃ |
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|
Dimensional Stability |
% |
0.12 |
0.12 |
0.12 |
200℃,2Hr |
ASTM D5213–04 |
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|
Physical Property |
Hygroscopicity |
% |
2.5 |
2.5 |
2.5 |
23℃,24Hr |
ASTM D570 |
|
|
Density |
g/cm3 |
1.38 |
1.38 |
1.38 |
23℃ |
ASTM D1505 |
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|
Wetting Tension |
mN/m |
60 |
60 |
60 |
23℃ |
IEC674-2 |
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|
Flame Retardant Grade |
|
VTM-0 |
VTM-0 |
VTM-0 |
Vertical Burning TEST |
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|
Chemical Property |
benzene |
Longitudinal Tension Retention(%) |
100 |
100 |
100 |
23℃ infiltrating for 10Min, |
ASTM D882 |
|
|
10%hydrochloric acid |
98 |
98 |
98 |
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|
10%sulphuric acid |
97 |
97 |
97 |
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|
5%sodium hydrate |
90 |
90 |
90 |
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